Satori Software announced that two of its industry experts, Senior Director of Postal Affairs Bob Schimek and Postal Product Specialist Kim Mauch, have been selected to speak at National Postal Forum, being held March 17 – 20, 2013 in San Francisco.
“I’m honored to share information that will help mailers ease the transition to electronic document submission — at the premier event of the mailing industry,” said Mauch. “I look forward to talking with our customers, seeing the new innovations in mail piece design and attending the educational sessions.”
Mauch will deliver “From Zero to eDoc in Plain English,” which covers the basics of electronic documentation and how using this technology helps mailers meet upcoming Full-Service Intelligent Mail requirements. Schimek will participate in “Smart People Can Do Great Things for the New Publishing Industry,” an interactive workshop which explores how the publishing value chain can navigate USPS mandated changes. Both sessions will take place Tuesday, March 19 at 9:30 am.
“National Postal Forum does a great job of bringing together education, training and technology,” said Schimek. “As we approach the January 2014 deadline for Full-Service Intelligent Mail adoption, whether you are a long time Satori Software customer or looking for the right solution to meet your mailing needs — we have plenty to talk about.”
Satori Software will be hosting short, informative presentations in booth 701 which outline the top actions mailers of all sizes must take in 2013 to meet changing postal regulations. Participants have a chance to win a Moleskine leather notebook or the daily grand prize: Bose noise-canceling headphones. These presentations will be held during exhibit hall hours March 18 – 20.
Mauch and Schimek will also facilitate topics for the National Postal Forum Peer-to-Peer Roundtable scheduled for March 19 from 4:30 pm – 6:00 pm. Mauch will be holding a discussion around “Keeping Current with Move Update.” Schimek will be moderating a discussion on “Mail.dat, What’s Coming Next?” discussing the changes to the specifications coming July 2013.