Mark Andy and Rotoflex had many things to celebrate at the recent Labelexpo Europe 2013 event including
• Receiving the 2013 Global Label Award for Innovation for Mark Andy ProLED UV LED curing system
• Debut of the 2013 FTA Technical Innovation Award winning Quick Change Die Cut (QCDC) technology
• 250th Performance Series Press Sale
• Introduction of Mark Andy Versa Max Flexible Packaging press
• Debut of Rotoflex URC 2.0 Control System
A media page has been created with links to press releases and images from the event. Please visit markandy.com/lx2013-media to view these news items.
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Mark Andy will be an exhibitor and keynote speaker for the upcoming Packprint Summit Americas event to be held 5-6 November, 2013, in Miami, Florida.